10th International Conference on High Temperature Ceramic-Matrix Composites - Register before May 31st!!

Conference Topics > Topic 12 - NDT and health monitoring

Topic 12 -  Nondestructive Testing and Health Monitoring of Ceramic Composites

 

Ceramic matrix composites degrade via a variety of mechanisms: transverse matrix microcracks, interlaminar cracks or delamination, oxidation ingress, oxidation/corrosion recession, fiber breakage, unbridged crack growth, etc… To understand composite damage development leading to end of life scenarios it is advantageous to develop techniques that can discern and/or monitor damage development either in-situ or for inspection. Techniques can be based on sound, X-rays, local strains, change in electrical properties, etc... These can be informative to life-modeling efforts either to help develop effective life models or when effective life models are developed to inform the user of the current state of the material. In addition, non-destructive techniques could be effective for quality control during composite component manufacturing in order to discern defects in the composite and/or poor infiltration regions. The aim of this topic is to discuss the latest developments in the areas of non-destructive techniques and in-situ health-monitoring techniques as they relate to inspection, quality control, damage detection, life prediction and/or the prediction of retained properties of ceramic matrix composites.

 

Proposed Sub-Topics

  • Ultrasonic inspection techniques for CMC's and CMC components
  • X-ray CT inspection techniques for CMC's and CMC components
  • In-situ NDE and health monitoring of CMC's and components
  • Use of Acoustic Emission to detect damage in CMCs
  • Use of Electrical Resistance to detect damage in CMCs
  • Digital Image/Volume Correlation (DIC/DVC) strain monitoring at room and elevated temperature
  • Relating NDE to retained properties and/or life-prediction

 

Point of Contact: Gregory N. Morscher, Univ. Akron, OH. gm33@uakron.edu

 

Scientific Committee:

  • Greg Ojard, UTRC, East Hartford CT, USA; ojardgc@utrc.utc.com
  • Emmanuel Maillet; General Electric GRC, Niskayuna, NY, USA;
  • Hui Mei, Northwestern Polytechnical University, Xi'an, China; meihui@nwpu.edu.cn
  • Nathalie Godin, Lyon, France; MATEIS, INSA de Lyon, nathalie.godin@insa-lyon.fr

 

 

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