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  • Table of All Topics
  • Topic 1 - Modeling
  • Topic 2 - Fibers & Preforms
  • Topic 3 - Interphases
  • Topic 4 - Oxide/oxide CMCs
  • Topic 5 - Non-oxide CMCs
  • Topic 6 - Additive Manufacturing
  • Topic 7 - UHTCs & MAXs
  • Topic 8 - EBC/TBC
  • Topic 9 - PDCs
  • Topic 10 - Carbon-carbon Composites
  • Topic 11 - Thermomechanical behavior and performance
  • Topic 12 - NDT and health monitoring
  • Topic 13 : Joining
  • Topic 14 - CMC in Space Applications
  • Topic 15 - Terrestrial transport & industrial applications
  • Topic 16 - Aeronautic applications
  • Topic 17 - Energy Applications
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Topic 13 - HT-CMC Joining and Integration issues

Joining and integration issues of CMC are subject of intense research worldwide, in particular now that CMC are widely used as structural materials not only for aerospace, but also for commercial aircraft engines, car brakes, key components for energy production, and much more.

For some HT applications, the existing CMC joining and integration options may be not suitable.

In addition, several joining materials proposed for CMC have not been properly tested at HT.

The aim of this symposium is to gather expert on these topics, from industry and academia, in order to discuss potential solutions and enable the fabrication and utilization of CMC components for high temperature structural applications.

Joining and integration of CMC include: adhesives, brazing, glass-sealing, diffusion bonding, transient liquid phase bonding, and surface engineering to increase the bon strength.

Reliable methods to test joint strength will also be part of this symposium.

Proposed sub-topics:

• Joining of CMC and multimaterials
• Joining of CMC at the nano- and micro-scales
• Design and modeling of CMC joints and interfaces
• Mechanical testing of CMC joined components
• High temperature wetting of CMC by metals
• Environmental resistance (high temperature, oxidation etc.) of CMC joints
• Nondestructive evaluation technique of CMC joints
• Constructional design issues of CMC joining
• Non-conventional joining methods including flash joining, plasma assisted joining, electrochemical joining and cold joining (T<300 ˚C)

Point of contact:

• Milena Salvo, Politecnico di Torino, Italy,  milena.salvo@polito.it

Scientific Committee:

Ch. Lorrette (CEA-France)

K. Lambrinou (SCK CEN- Belgium)

S. Grasso (Southwest Jiaotong University-China)

P. Tatarko (Institute of Inorganic Chemistry, Slovak Academy of Sciences; IIC SAS-Slovakia)

V. Casalegno (POLITO-IT)

L. Goglio (POLITO-IT)

M. Herrmann (TU Dresden-DE)

Th. Weissgaerber (Fraunhofer IFAM Dresden, DE)

T. Koyanagi (ORNL-USA)

T. Hinoki (Kyoto Univ. -Japan)

H.P. Martin (IKTS-Fraunhofer-Germany)

J. Wang (Shenyang National Laboratory for Materials Science, Chinese Academy of Sciences-China)

C. Henager (PNNL-USA)

T. Nozawa (Rokkasho Fusion Institute-Japan)

M. Halbig (NASA-USA)

J. Barcena (Tecnalia, Spain)